Product Description
catalogue
1, Introduction to UV-CT Silicon Wafer UV Cutting Machine
2, Introduction to Dazu Laser Company
3, Basic configuration list
1, Introduction to Silicon Wafer UV Laser Cutting Machine
Appearance diagram of silicon wafer ultraviolet laser cutting machine (specific structure and appearance shall be subject to the actual product)
System Overview
The silicon wafer ultraviolet laser cutting machine is the latest high-end product developed. It is a product developed based on customer needs
High precision laser processing equipment.
This machine adopts a UV end face pumped laser and high-precision X-Y- θ
The CCD image processing system for alignment and real-time observation effectively ensures high-speed and high-quality slicing requirements.
Introduction to the overall system solution
The overall system scheme of the wafer laser cutting machine is shown in the figure (the machine is subject to the actual product, and the following figure is only for the original operation of the entire machine)
As shown in the explanatory reference, the entire system mainly consists of the following five parts:
Laser and external optical path auxiliary adjustment system;
Cooling system;
Control system;
Image recognition system
Sports system;
Laser cutting software.
The entire machine adopts a fully enclosed optical path system (not indicated in the enclosed structure diagram) to prevent the leakage of ultraviolet light, and the laser head can be raised
The adjustment range for lowering and lifting is 0~10mm. During processing, the laser head can be lifted and lowered with a lifting stroke of 10mm
The one-way travel time is 3-5 seconds, and the travel range of the workbench is scheduled to be 300X100mm. (Different trips can be customized according to customer needs)
(Workbench).
The workbench in the entire machine adopts a two-dimensional workbench and a high-precision rotating workbench, with a positioning accuracy of ≤ ± 5 μ m. Repetitive
Positioning accuracy ≤ ± 3 μ M;
The working principle of the entire machine is shown in the figure. The stroke of the two-dimensional workbench is 300X100, and the cutting diameter is Ø 100-200mm.
The working steps of the entire machine are:
Firstly, during the installation process, ensure the coaxiality of the feeding table and the rotating table through physical adjustment, (≤
0.05mm)
Place the workpiece to be processed into the positioning ring (the diameter of the positioning ring is specified as required)
The negative pressure generated will be fixed by adsorbing the workpiece onto the workbench through ceramic suction cups,
Move the workbench to the designated position and use the CCD image recognition system for positioning and fine-tuning;
Turn on the laser, rotate the worktable for circular cutting, and after processing, move the worktable to the feeding position,
The operator will take and place the materials for the next processing.
★ Note: As the positioning method of this equipment mainly relies on the outer circle size of the workpiece to be processed for positioning, therefore
The coaxiality accuracy between the workpiece to be processed and the outer circle will directly affect the machining accuracy of the equipment. Please pay attention.
System characteristics
High quality laser beam, actual batch production, single cutting seam width 10-15 μ m. Single cutting depth ≥ 25 μ M,
(Note: If the Wafer thickness is thick, multiple cuts are required to cut it, which will also cause the cutting seam to become wider.)
The width depends on the number of cuts
Reliable and high-precision X-Y- θ Workbench
A CCD image processing system for real-time observation, with software automatically performing parallel correction.
Efficient and flexible software operating system
technical parameter
System model UVCS-10
Laser type UV
X-Y- θ Workbench
Workbench stroke 100mm x 100mm x 360 °
Resolution X and Y axes: ± 1 μ M θ Axis: 1 "
Positioning accuracy X and Y axes: ± 5 μ M θ Axis: ± 15 ″
Flatness ± 5 μ M
Straightness ± 5 μ M
Encoder resolution 1 μ M
effect
Single cutting seam width 10-15 μ M
Single cutting depth ≥ 25 μ M
Cutting speed of 100mm/s (may vary depending on different products)
Laser system safety level 1
Environmental requirements for use
Power demand 220V/single-phase/50Hz/15A
Environmental temperature 20-25 ºC
Environmental humidity 20% -60%
Compressed air 0.5MPa
Compressed air interface Φ 8mm
Environmental vibration requirements: foundation amplitude<5 µ m, vibration acceleration<0.05G
Whole machine weight ≈ 0.5T
Overall dimensions: height x depth x width: 1.55x0.9x0.8 (with display 1.2) m
Size of chiller: height x depth x width: 0.65x0.65x0.32m
3, Basic configuration of UV-CT ultraviolet laser slicing machine
Number, Part Name, Model and Specification, Quantity, Origin and Manufacturer's Name
1 Industrial computer IPC 1
2 monitors, 15 inch color display, 1 domestically produced
3 Chiller HC500B-01B 1
4 Sports
Control Card Three Axis 1 Galil, USA
5 Main control box DP-HR50L 1
6 Software UV-CS 1
7 lenses F=25mm 1 imported lens,
8 voice coil motor stroke 10mm 1
Customized 9 beam extenders with 1 imported lens,
10 sound and light Q-head QS 1 UK GOOCH
11 Workbenches X, Y Θ 1 set imported from Japan
12 CCD camera, 300000 pixels, 1 set CORECO
13 acquisition card PC2-VISION 1 CORECO
14 Laser reflection and
Output lens group
High power, high reflection, and output
Laser lens 1 imported
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
Audited Supplier 
Audited Supplier 
){kind=link}
){kind=link}