High End Laser Processing Ceramic Equipment

• Function: Laser Cutting
• Demoulding: No
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Model NO.: Himalaya-6688-8
• Installation: Desktop
• Driven Type: Electric
• Mould Life: Laser Warranty for One Year
• Transport Package: Complies with International Logistics Standards
• Specification: 1400 x2400x 2440 (including tricolor light)
• Trademark: Himalaya
• Origin: China
• Production Capacity: 1

Product Description

Product Description

Technical recommendation of 2 station ceramic laser dicing machine

introduce : >High precision laser processing system: collimation + focusing lens, advantage integration >Automatic loading and unloading to reduce manual participation >Imported laser with stable power output to ensure the consistency of processing technolog >The system automatically records the processing performance data and visually displays the running state >Modular design is convenient for debugging and maintenance >Compatibility design to meet the processing of ceramic sheets of different specifications >One person operates multiple machines, saving labor Processing principle: The laser beam is focused by the optical system and irradiates on the material surface. Its high-density energy makes the material instantly rise sharply to form a melting zone. Through auxiliary blowing, the molten material is removed to form a cutting path.
Ceramic sheet: Used for making ceramic substrate, plate splitting and cutting, etcIt mainly includes alumina, aluminum nitride and other materials Performance: >Applicable product thickness range : 0.1mm- 3.0mm >Scribing speed  :40- 150mm/s , It is related to film thickness >Spot size :40- 100μm >Compatible dimensions : 110mm × 110mm ~ 300mm × 300mm >Machining accuracy : ±10μm >he depth of the line can be adjusted, and the depth consistency is : ± 20um >Minimum line width 50um (varying with depth)

 

technical      requiremen	Is it an integral table	/	Integral table
	Substrate size	MAX:160*300mm	110mm × 110mm~300mm × 300mm
	Automatic processing substrate size	≥197*150	110*110mm-300*300mm
	thickness	0.25-1.5mm	0.1-3mm
	Dimensional deviation - single head	±0.01mm	±0.01mm
	Dimensional deviation - Comparison of two ends	±0.03mm	±0.03mm
	Depth deviation - single head	±0.02mm	±0.02mm
	Depth deviation - Comparison between two ends	±0.04mm	±0.04mm
	line width	≤0.1mm	≤0.1mm
	Scribing speed	40-150mm/s	40-150mm/s
	Axis positioning accuracy	±2.5um	±2.5um
	Axis repeat positioning accuracy	±2um	±2um
	Spot size	40-100μm	40-100μm
	Alignment mode of initial point in ceramic wafer     processing	CCD positioning	CCD positioning
	Laser type, brand	Quasi continuous IPG, fully imported	Quasi continuous IPG, fully imported

Serial       number	name	Model and specification	Quantity (set)	Original manufacturer and origin
1	Three axis gantry platform(X\Y\Z)	250*900*50mm	1	H
2	guide	N2535500	4	Akribis/Import
3	Linear motor	/	2	Import
4	Grating and reading head	RGH24	2	Renishaw/Import
5	Fiber laser	YLM-150/1500-QCW-AC-Y11	2	IPG/Import
6	IPC	Han ,s customization	1	Advantech/china
7	Cutting head	FM220-100	2	RayTools/Import
8	Transfer assembly	Han ,s customization	2	H
9	softw	Han family precision micromachining    software	1	H
10	monito	1715S	1	DELL/Import
11	Motion control system	CMba2C04NA00WNNNYN ACS	1	ACS/Import
12	PLC	6ES7 288-1ST0-0AA0	2	SIEMENS/Import
13	Frame and housing	Han ,s customization	1	H
14	Fixture	Han ,s customization	1	H
15	Loading and unloading table	Han ,s customization	2	H
16	Dust collector	/	1	H
17	Pneumatic components	/	/	CHELIC,SMC/Import

explain: The following contents are general requirements, and the details will be adjusted according to the needs of customers

name	parameter	remarks
Overall dimension (w * L *    h)	3450mx 2300mmx 2000mm	For reference only
Floor size	3500mmx 3000mmx 2000mm	For reference only
weight	≈3.5ton
ambient temperature	20~25ºC	The temperature fluctuation is less than ± 2 ºC
ambient humidity	40%~60%	No condensation
Power Supply	AC 220/380V ±5% /50Hz/63A	The grounding is good, and the grounding resistance is less than 4      ohms
Power	10KW	Theoretical peak power
compressed air	0.6~0.8MPa	3 quick plug connectors (with φ 8mm (gas tube)
Dust extraction	φ100mm	Connect with the customer's Central purification system
Vibration source	VC-B	Avoid installing near the punch and other sources

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.