Product Description
Fully automatic laser debonding equipment
Adopting DPSS laser and professional laser debonding system
DPSS laser with good stability
Paired with a special peel off coating, the material is undamaged and has a high yield rate
Integrate multiple laser shaping technologies, compatible with multiple processes
Optimized TOP-HAT spot shaping module
Advanced spectroscopic shaping technology
A detection system designed specifically for the semiconductor industry, more reliable
Laser processing energy monitoring and automatic compensation system
Spot quality monitoring and feedback
Online intelligent loading and unloading and cutting system, more convenient
Fully automatic production of 12 inches (including 8 inch pieces)
Fully automatic loading and unloading and temporary substrate recycling
Supports SECS-GEM protocol
The principle of ultraviolet laser debonding: The laser wavelength is less than 380nm, the photon energy is greater than 3.26eV, which is higher than the bond energy of C-N bonds at room temperature (3.17eV), and the laser is shaped in a specific way
The main function of materials is the photochemical mechanism, which directly breaks the chemical bonds of polymers, allowing the materials to completely decompose and detach as small particles or gaseous groups, belonging to the cold processing process.
UV laser debonding processing method: a fixed size laser spot is obtained through optical path shaping, and a galvanometer is used to scan and process the glass wafer surface with a fixed laser energy (as shown in the above figure)
Finally, the separation of device wafers and glass wafers is achieved.
Wafer size: 8 inches/12 inches
Stripping efficiency: 50s/pcs/100s/pcs
Process effect after laser debonding:
After debonding, Glass and Si Wafer separate on their own under slight external forces
1 laser<20W (output port)
2 X/Y linear workbench 400 * 600 XY
Journey: 400 × 600mm
Resolution: Y=0.1 μ M; X=0.5um
XY repeated positioning accuracy:<=2 μ M
3 Processing system/
Maximum speed: 5000mm/s
Accuracy: ± 10 μ M
Installation surface flatness: less than 20 μ M
4 CCD/
1.3 million pixels;
High pixel telephoto lens
5 Spot analysis/
Complete set of imported spot analyzer+attenuation level,
Monitoring the laser spot status
Main technical indicators and parameters
1. Laser working wavelength<380nm
2. Maximum output power of laser<20W (output port)
3 laser focal depth ± 500 μ M
4 machinable wafer sizes of 8 inches and 12 inches
5 X and Y-axis accuracy
Straightness: ± 1.5 μ M
Repetitive positioning accuracy: ± 2 μ M
Positioning accuracy: ± 4 μ M
6 Z-axis lifting range stroke: 0~50mm
7 Z-axis repetition accuracy error Repetitive positioning accuracy: ± 5 μ M
1. Power supply single-phase 220V ± 10% 50/60Hz 15A (max)
2. Compressed air pressure: 0.6~0.8Mpa, air volume: 250L/min, pipe diameter: Φ 12mm
3 N2 pressure: 0.2~0.4Mpa, gas flow: 100L/min, pipe diameter: Φ 8mm
4. Equipment size 2100 (L) mm × 2050 (W) mm × 2450 (H) mm already includes a height of 590mm for three color warning lights
5 main engines weighing 3 tons
6. Environmental temperature and humidity Temperature: 22 ± 2 ºC
Humidity: RH 62 ± 7%
No obvious condensation is sufficient
7 dust-free level 10000 level
8. Ground bearing capacity 500kg/m²
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
Audited Supplier 
1 laser<20W (output port)
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