Efficiency Laser Trimming Equipment for Rapid Mass Production of Various Specifications of Chip Resistors

• After-sales Service: Provided
• Condition: New
• Warranty: Provided
• Automatic Grade: Manual
• Installation: Vertical
• Driven Type: Pneumatic
• Product Name: Laser Trimming
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation system isbased on precision laser trimming . The system is equipped with a fully automatic loading and unloading mechanism and a visual positioning automatic correction system , which is easy for automated mass production , and is especially suitable for rapid mass production of various specifications of chip resistors.

1 . Fully automatic loading / unloading mechanism to greatly increase production capacity
2 . Equipped with intelligent vision automatic positioning correction system to realize high-precision positioning of chip resistor substrates
3.Self-developed PMU measurement system , with high accuracy speed , good consistency and full range resistor trimming .
4 . Self-developed resistor trimming software system supports various types of resistor trimming knife , and can be customized to meet needs of customers
5 . The equipment is stable and reliable , and the parameter values of modified products are highly reliable and will not drift :
6 . Low cost of operation and maintenance , whole machine is highly efficient with low energy consumption , built-in dust-proof , anti-static , leakage protection and perssafety protection functions , rest assured to use

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.