| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Condition: | New |
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Customized ultra-fast picosecond / femtosecond lasers with low thermal effects
Self-developed drilling process technology which meets different process requirements
Excellent hole formation quality, high real roundness and small taper
Support visual positioning of various features
| Technical specification | |
| Laser power | 10-100W |
| Processing speed | 8000 holes/sec (hole diameter, hole spacing related) |
| Applicable material thickness | ≤0.5mm |
| Bore Accuracy | ±5% |
| Position accuracy | ±10μm |
| Stage travel | 300×300mm(customizable) |
| Automation configuration | Stacked cassette, four robots automatic loading and unloading |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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