| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Condition: | New |
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1. Excitation - Greatly improve the wetting performance of the surface to form an active surface;
2. Cleaning - Removal of dust and oil, fine cleaning and anti-static;
3. Improve surface adhesion;
4. Improve the reliability and durability of surface bonding;
| Function configuration | Technical parameters |
| Model | 5DG-APR Automatic Plasma Treatment System |
| Dimensions (mm) | L=1010,W=1360,H=2020 |
| Weight (kg) | 650 |
| Control | PLC+ Touch screen |
| Programming | Manual |
| Conveyor | Belt conveyor |
| Conveyor height (mm) | 900±20 |
|
Stepping motor conveyor (m/min) |
20 |
| X,Y drive mode | Servomotor + ball screw |
| Max. moving speed (mm/s) | 800 |
| Running accuracy (mm) | ±0.05 |
|
Numbers of spraying gun |
1 |
| Type of spraying gun | Rotating head (standard) Pointed head |
| Working direction | Left to Right (standard) Right to left |
| Repeatability (mm) | ±0.05 |
| Working area (mm) | X=550; Y=550 |
| Processing power (kw) | 0.5 / 1 |
| Single processing width(mm) | Rotating head 50 / Pointed head 8-10 |
|
Effective processing height (mm) |
3-15 |
| Max Processing speed (mm/s) | 800 |
| Plasma length (mm) | 20 |
| Input air pressure alarm | Menu + sound and light alarm |
| Power supply | 220 V 50-60 Hz |
| Required Air pressure (kg/cm2) | 4 |
| Type of gas supply | Compressed air or nitrogen |
| Rated power (kw) | 2 |
| Safety standards | CE |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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