| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Condition: | New |
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FEATURES:
1. Stable operation - Adopt integral casting iron frame and gantry platform to improve operation stability;
2. Use WINDOWS operating system - fault sound and light alarm and menu display;
3. Variety of programming modes - programming methods to meet various needs;
4. Removal of dust and oil;
5. Fine cleaning and static elimination;
6. Improve surface adhesion.
Product advantage:
1. Online plasma treatment: completely automated high production atmospheric plasma treatment processing;
2. Atmospheric pressure plasma: generate plasma solely using compressed air without the need for carrier gases;
3. Multi-functional: system can be used as standalone or placed inline with upstream or downstream operation processes;
4. Environmentally friendly: zero chemicals are used and no harmful substances are produced;
5. Cleaning: remove fine dust, oil, grease, organic, inorganic and microbial contaminants;
6. Activation: Increase surface energy to promote wetting and adhesion;
| Function configuration | Technical parameters |
| Model | AP-7 |
| Number of axies | X,Y,Z |
| Driver | Stepping motor + synchronous belt (X/Y) |
| Max moving speed(mm/s) | 500 |
| Positional accuracy(mm) | < 0.06 |
| Repeatability(mm) | ±0.02 |
| Working area (mm) | L320×W300 x2 |
| Max. conponents height(m) | ± 30 |
| Number of conveyor | 2 |
| Amplitude modulation mode | Automatic |
|
Amplitude modulation speed (mm/min) |
250 |
| Conveyor height (mm) | 900±20 |
| Conveyor speed (m/min) | 2-5 |
| Conveyor type | Green ESD belt |
| Conveyor direction | L → R (R → L optional) |
| PCB edge space(mm) | ≥ 3 |
| Maximum load | 4kg/m uniform distribution |
| Facility footprint(mm) | L600×W1500×H1560 |
| Power supply | AC220V 10A 50/60Hz |
| Required Air pressure (Mpa) | 0.6 air source |
| Exhaust | Upward exhaust |
| Standard configurations |
Plasma cleaning; Coston light; Conveyor belt; Access card |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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