High Speed, High Precision, Multiple Varieties, and Large-Scale Production Automatic Dispensing and Pasting Machine

• After-sales Service: Provide
• Warranty: 12 Months
• Product Name: Automatic Dispensing and Pasting Machine
• Feature: High Speed, High Precision
• Certification: ISO
• Condition: New
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

 

This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and rigorous process control. Breakthrough in key technologies such as precise alignment of microchips, multi axis high-precision closed-loop motion control, automatic height measurement, and precision pressure control. Implemented functions such as dispensing, dipping, SMT, freely combining multiple loading methods, intelligent switching of SMT heads, and automatic transmission on the assembly line; Capable of high-speed, high-precision, multi variety, and large-scale production.

 

The dipping system can choose from multiple dipping heads for replacement;

Top pin inventory includes different models of top pins, suitable for various chips and blue films;

The wafer bin can be programmed to use different crystal discs, and the equipment can automatically pick and place them;

Measure the height of the substrate and dynamically monitor the installation height;

Patch tip library, supporting the simultaneous use of up to 7 types of patch tips;

By using a visual calibration system, automatic calibration of overhead cameras, overhead cameras, wafer cameras, and suction heads is achieved.

Main technical parameters:

Surface mounting accuracy: XY direction ≤ ± 10 μ M; θ Angle deviation: ≤ ± 1 °;

SMT efficiency: ≤ 3s/piece (including dispensing time); Loading wafer size: 6 inches;

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.