| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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| Application field | circuit board |
| Processing material | FPC copper plate |
| Plate thickness range | ≤1.0mm |
| Drilling speed | ≥300 holes/s (Material,12μmCu/25μmPI/12μmCu,75μm BVH/TVH) |
| Drilling accuracy | X&Y axis ≤±20μm, pore CPK≥1.33 |
| Effective processing size | 550mm×650mm |
| Fixed mode | vacuum adsorption platform |
| Drilling aperture range | ≥25μm, PI or copper burr ≤3μm |
| True roundness | TOP≥90%, BOT≥90% (Material,12μmCu/25μmPI/12μmCu,75μm BVH/TVH) |
| Aperture tolerance | ≤±5% |
| Taper (upper and lower aperture ratio) | Taper (hole bottom/hole top)≥80% (Material-12μmCu/25μmPI/12μmCu.75μm BVH/TVH) |
| Drive system | vibrating mirror platform linkage |
| Positioning accuracy | ±2μm |
| Repeat positioning accuracy | ±1μm |
| Maximum acceleration of the machine | 1.5G |
| Precision positioning | 5 million pixels 1.6mmx1.2mm |
| Rough positioning | 5 million pixels 9.6mmx7.2mm |
| Surveillance camera | 130W, 30mmx30mm |
| Focus spot size | ≤25μm |
| Equipment size | length× width × height = 1500mm×600mm×1700mm (excluding tricolor lamps) |
| Equipment weight | 2100kg |
| Equipment power supply | AC 3x380V/25A |
| Equipment gas source | 0.4-0.6MPa |
| Base material | marble base |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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