Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer

Product Details
Customization: Available
After-sales Service: Provided
Condition: New
Gold Member Since 2023

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  • Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
  • Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
  • Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
  • Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
  • Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
  • Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Product Name
Semiconductor Equipment
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
Laser Internal Modification Machine for SIC / Si wafer

Equipment features:
1. Specially designed laser system
2. Excellent cutting effect
3. Fully automated production
4. High precision visual system; Automatic alignment and autofocus; High precision motion platform
5. Compatible with 4/6 inch production
6. SECS GEM standard interface


Application scope: Silicon MEMS sensors, pressure sensing chips, microphones, temperature measurement chips, RFID, biochips, and other silicon substrate wafer laser cutting

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer

 
Exhibition & Customers

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si WaferIntegrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si WaferJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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