Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%

Product Details
Customization: Available
After-sales Service: Provide
Warranty: 12 Months
Gold Member Since 2023

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  • Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%
  • Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%
  • Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%
  • Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
HTS800
Certification
ISO
Condition
New
Function
Laser Resistor Trimming
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
 
Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%
Laser resistor trimming is achieved by positioning a very thin laser beam on a thin-film or thick-film resistor . The beam cuts the resistor according toa computer-predetermined program , thus trimming the resistance value by changing the cross-sectional area of the resistor . The resistance value ismeasured in real time through the high-speed measurement system while the laser is cutting the resistance , so that it is constantly approaching thetarget resistance value . When the resistance reaches the target resistance value , the laser beam is turned off to realize precise trimming of theesistance . The laser trimming system has a variety of trimming functions . It can trim thick or thin film resistor networks , capacitor networks ,ceramic-based thin film integrated components , and realize function trimming of hybrid integrated circuits.
Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%
System Parameters
Hi-Precision Laser Resistor Trimming System Solution Parameters
Laser Configurations HTS800-RH HTS801-RH
Laser type Fiber lase UV lase
Central wavelength 1064nm 355nm
Output power 20W 1W/4W(optional
Repeated frequency 1-100kHz 1-500kHz
Pulse width 3-500ns <15ns
Typical spot size 15-40um 10-15μm
Laser Beam
Positioning
Scan range 70mm*70mm 50mm*50mm
Scan resolution lμm lμm
Repeated positioning ±1μm ±1μm
Vision Coaxial monitoring 500W pixel surveillance camera
Side axis positioning system 500W pixel camera,with CCD intelligent controller (optional
Work
platform
Moving platform Linear motor with grating ruler
Moying range 200mm*300mm
Repeated positioning ±2um
Max moving speed 1000mm/s
Measure-
ment
System
Test system compatibility Compatible with low/medium/high resistance measurement
Test method 2-wire or 4-wire measurement
Resistance measurement Measuring range 50mQ~100MQ
Low resistance:±0.05%+0.5%/R(Q),Medium resistance:±0.05%,High resistance:±0.05%+0.05%xR(MQ)
Voltage measurement Measurement range -10V~+50V,full range measurement accuracy is 0.01%
Measurement channe 48~288 (each board has 48 channels,expandable)
Measurement time 2us/time,can be adjusted according to customer needs
Error compensation One-key automatic calibration
Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%
Application

Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%

Exhibition & Customers

Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment

Packaging & Shipping

 

Laser Resistor Trimming with Self-Developed Pmu Measurement System, Resistance Measurement Accuracy up to + 0.05%

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