Automatic Lead Wire Bonding Bonder Machine

Product Details
Customization: Available
After-sales Service: Online Service
Warranty: 1 Year
Diamond Member Since 2023

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  • Automatic Lead Wire Bonding Bonder Machine
  • Automatic Lead Wire Bonding Bonder Machine
  • Automatic Lead Wire Bonding Bonder Machine
  • Automatic Lead Wire Bonding Bonder Machine
  • Automatic Lead Wire Bonding Bonder Machine
  • Automatic Lead Wire Bonding Bonder Machine
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  • Overview
  • Product Description
  • Detailed Photos
  • Exhibition & Customers
  • Field Application
  • FAQ
Overview

Basic Info.

Model NO.
HM001
Transport Package
Air Freight
Trademark
Himalaya
Origin
China
Production Capacity
200

Product Description

Product Description
 Packaging and delivery

Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production and stricter quality requirements, fully automatic lead wire bonding machines with high efficiency, accuracy, and consistency in bonding quality have become essential process equipment for microwave integrated component manufacturing.

The fully automatic lead wedge welding bonding machine is mainly used to complete the lead bonding process, achieve a solid electrical connection between two solder pads on the device, and can be widely used in the manufacturing of semiconductor devices, hybrid circuits, microwave devices, and components. The main product features include high bonding efficiency, high precision, multiple types of solderable gold wires, controllable lead arc, and machine vision teaching and programming.
Function Description:
The lead arc can be set according to the process; Full process visualization programming;
Save product process data; Online monitoring of welding quality;
The bonding pressure can be precisely controlled; Chopper counting function;
Main technical parameters:
Bond strength: meets the requirements of method 2011.1 in GJB548B-2005;
Wire diameter size: Φ (18-50) μ M; XYZ axis repetition accuracy: ± 3 μ M;
Welding range: 150 x 150 (mm); Welding pressure: 5GF~150GF;
Maximum cavity depth: 10mm; Maximum temperature of heating table: 200 ºC;
Ultrasonic power: (0-10) W; Transformer frequency: 98 ± 3kHz;
Bonding speed (depending on product situation): 1.2 seconds per line (actual product).
Detailed Photos

 

Automatic Lead Wire Bonding Bonder MachineAutomatic Lead Wire Bonding Bonder MachineAutomatic Lead Wire Bonding Bonder Machine

 

 
Exhibition & Customers

Automatic Lead Wire Bonding Bonder Machine

Field Application

 

Automatic Lead Wire Bonding Bonder Machine
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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