| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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1,Scope of application
Electroplating and electroforming process with high uniformity of coating and high quality of coating.
2,application area
It is applied to electroplating and electroforming of products such as electronics, packaging, precision components and new materials.
3,Equipment features
1, selection module: precision servo transmission system, ultrasonic cleaning system, exhaust system, closed room system, special hanging basket;
2, standard specification: double slot or three groove structure (within a certain range of size can be customized); automatic and manual two series of optional;
3. Key equipment such as compressors, fans and circulating pumps are all imported equipment to ensure reliable and efficient operation of the equipment.
4, high cleaning efficiency, short time, thorough cleaning, no pollution of two times, can achieve minimal damage to the workpiece.
5, double layer condensing coil design, double compressor independent refrigeration, 150% super large condensing area, unique "solvent retention" characteristics, each layer condensing system independent operation;
6, gravity liquid water separator with molecular sieve function and circulation filtration system to improve circulation utilization rate of solvent.
7, the equipment has the function of automatic detection and prompt change of cleaning agent, and automatically replace the dilute solution according to the change of boiling point.
4,Application field
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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