High Precision Machining and Consistency Wafer Laser Scribing / Cutting Equipment

• After-sales Service: Provided
• Condition: New
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Wafer Laser Scribing / Cutting
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Product Features

• Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency

• Correction technology ensures high precision machining and consistency

• Auto-positioning, auto-focusing, auto-detection, ensuring high yield rate

• Support warpage/TAIKO wafer transfer

 

Application

TAIKO ring cutting, Si/SiC
wafer cutting, Si/SiC wafer
Back metal cutting

Technical specification
Laser wavelength	355nm
Laser output power	15/30W
Processing method	Combined scanning and linear/rotary stage motion
Positioning accuracy	±1μm
Processing accuracy	±5μm
Wafer size	6 inch, 8 inch, 12 inch
Chipping	<10μm

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.