Projection Lithography Machine Suitable for Packaging Micro LED Mems and Other Processes

• After-sales Service: Provide
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Model NO.: MPS-02
• Driven Type: Electric
• Product Name: Projection Lithography
• Application: Positive Exposure, Positive Alignment
• Advantage: Factory Price
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

MPS-02 Projection lithography 
Product advantages
High yield.
Modular design.
High reliability.
Suitable for packaging MicroLED MEMS and other processes

Wafer Size	200mm Wafer(300mm selectable)
Wafer thickness	0.1mm~5mm
Resolution	2μm L/S
Linewidth accuracy	±10%
Depth of focus	20μm
Front engraving accuracy	0.5μm
Capacity	150WPH
Imaging material	photoresist(PR)
Light source spectrum	365nm
Exposure energy	20-1000mj/cm² or higher
Reticle	9 inch
Applicable process	positive exposure, positive Alignment
Single power supply	AC380V-50HZ(Primary equipment)
Weight per unit	6500kg
Overall dimension(L×W×H)	Host machine:3100mmL×1750mmW×2750mmH Accessory equipment:1300mmL×880mmW×1,650mmH
Temperature/humidity	22ºC±1ºC,30%-55%

 

 

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.