Test System Power Device Testing System Qt-3102 Thermal Resistance Tester

• After-sales Service: Provided
• Condition: New
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Model NO.: QT-3102
• Product Name: Thermal Resistance Tester
• Feature 1: Power Device Testing System
• Feature 2: Field-Effect Transistors
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

QT-3102 Thermal Resistance Tester

QT-3102-XX Testing Device types:Transistors,Field-Effect Transistors,IGBT,Diodes,optional SCR.
It can be internally integrated QT-4100's DC testing for high-power built in thermal resistance testing.
Dual Die testing can be achieved through scanbox.

 

Key Technical Specifications:

 

Parameter	Range	Step current/Votage	Accuracy
Bias Current IE/IDS	0.01 to 20A/50A	0.01A	±1%+2mA
Measurement Current (IM)	1 to 100mA	1 mA	1 to 39 mA ±1% + 0.2 mA 40 to 100 mA ±3%
Gate Voltage (Gate-L)	1.0 to 20.0V(Fixed initial value of +5v)	0.1V	±0.5V
Power time (PT)	Within Bias Power Range 300us to 200ms	1 us	Crystal
Delay time (DT)	10 to 999 us	1 us	±1 us Crystal
Upper/Lower Limit	0 to 9999 mV	1 mV	/
	0 to 999.9 mV	0.1mV	/
VCB/VDS	1 to 100V / 200V	1 V	±0.2% + 0.1V

• Maximum current and highest voltage depend on the model, with maximum currents of 20A and 50A, and maximum voltages of 100V and 200V, respectively.

 

• The company reserves the right to revise all technical parameters at any time without prior notice

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.