Professional Manufacture Wholesale Small Convenient 20W Laser Marking Machine Engraving Machine High Speed

• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Laser Wavelength: Fiber Laser
• Laser Classification: Semiconductor Laser
• Model NO.: YLP-H20
• Product Name: Fiber Laser Marking
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

1. Various metal materials, part of non-metal materials.
2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.

Features:

1. Laser marking machine on promotion, high cost performance.
2. Fiber lasergenerator ,low consumption, easy for maintain.
3. Compact design, 760mm×610mm×1494mm
4. Optional lens for different marking area

Specification:

1	Laser Wavelength	1064nm
2	Laser Power	20W
3	Repeating Frequency	10-200KHz
4	Marking Field	100mm×100mm(F160)
5	Marking Line Width	≥0.05mm
6	Marking Window Upgrade	160mm x 160mm (F254 Lens)
		290mm x 290mm (F420 Lens)
7	Min. Character Size	0.3mm
8	Marking Speed	≤7000mm/s
9	Repeat Accuracy	±0.003mm
10	Cooling system	Air cooling
11	System Weight	Around 155KG
12	Power Supply	220V/Single Phase/50Hz/60Hz/5A
13	Power Consumption of Complete Machine	500W
14	Overall Dimension	760mm×610mm×1494mm

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.