Laser Debonding Machine with Real-Time Monitoring/ Automatic Compensation/ Ensuring Process Stability

• Condition: New
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Laser Debonding
• Feature 1: Stripping and Cleaning Functions
• Feature 2: Real-Time Monitoring
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Product Features

• Laser debonding, stripping and cleaning functions

• Square top hat beam, benefits high debonding efficiency and low thermal damage

• Real-time monitoring and  automatic compensation, ensuring process stability

• Providing wavelength- matching bonding adhesive
  
   

  Application
  Debonding of temporary bonded
  wafer by laser, followed by
  separating, and cleaning, for
  carrier substrate re-use and
  ultra-thin wafer subsequent
  processing

Technical specification
Laser wavelength	355nm/1340nm
Wafer size	6 inch,  8 inch, 12 inch
Laser power	15/30W@355nm, 100W@1340nm
Focused spot size	X:0.2mm~1.0mm, Y:0.2mm~1.0mm
Laser energy density	0.05-1J/cm^2
Typical Laser Scan Time	100 sec@12 inch

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.