High End Semiconductor Fully Automatic Molding Equipment for Lead Frame/Substrate

• Function: High Temperature Resistance
• Demoulding: Automatic
• Condition: Used
• Certification: ISO
• Warranty: 6 Months
• Automatic Grade: Automatic
• Model NO.: Himalaya-34
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Product Name: Fully Automatic Molding Equipment
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Single machine plastic sealing equipment

1, Main parameters of the equipment
1. Mold closing pressure: 98-1176kN.
2. Injection pressure: 1-29.4kN.
3. Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0 15-1.2mm.
4. Applicable plastic sealing material specifications: diameter: φ  11- φ 20mm (± 0.2mm), aspect ratio, length/diameter=1.2-2.0
(Max 35mm).
5. Control system: PLC (Omron); Pressure curve output and storage.
6. Operating system: 7-inch touch screen.
7. Loading and unloading method: Manual loading and unloading.
8. Optional: Mold vacuum system and isolation film system.
9. Safety protection system: safety grating, leakage protection device, emergency stop button device, and safety sensor equipped
Fully protected door.
2, Equipment dimensions and weight:
Overall dimensions (mm)
L x W x H
Size after opening the door (mm)
Lmax * Wmax*
Hmax
Equipment weight (T)
Single press+extraction
Dust machine 1340 * 1775 * 2100 1810 * 3300 * 2100 2
3, Environmental parameter requirements:
1. Temperature range: 22-28 degrees Celsius;
2. Humidity range: 50% -75%;
3. Workshop cleanliness level: 100000 level;
4. Requirements for foundation use: bearing a weight of 2 tons/square meter;
4, Equipment connection requirements:
1. Equipment power:
Voltage power
(kW)
Cable specifications
(mm) ²)  Uninterruptible power supply
Single compressor AC 380V,
50/60Hz
11 6\
2. Gas demand:
Demand pressure (kgf/cm) ²)
Connection diameter
(mm)
Flow rate (m ³/ H)
Compressed air requires 6 6 6 1
Hydrogen\
Gaseous nitrogen\
3. Cooling system: No need
4. Requirements for exhaust gas ventilation: 100mm ventilation pipe
5, Equipment display:

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.