Auto-Positioning Si/Sicwafer Cutting Machine with Warpage/Taiko Wafer Transfer

• Customization: Available
• After-sales Service: Yes
• Condition: New
• Model NO.: HM001
• Speed: High Speed
• Precision: High Precision
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Transport Package: Air Freight
• Trademark: Himalaya
• Origin: China
• Production Capacity: 200

Product Description

Product Description

Product Features

• Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency

• Correction technology ensures high precision machining and consistency

• Auto-positioning, auto-focusing, auto-detection, ensuring high yield rate

• Support warpage/TAIKO wafer transfer

 

Application

TAIKO ring cutting, Si/SiC
wafer cutting, Si/SiC wafer
Back metal cutting
 

Technical specification
Laser wavelength	355nm
Laser output power	15/30W
Processing method	Combined scanning and linear/rotary stage motion
Positioning accuracy	±1μm
Processing accuracy	±5μm
Wafer size	6 inch, 8 inch, 12 inch
Chipping	<10μm

Detailed Photos

 

Exhibition & Customers

Field Application

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.