Die Attach and Die Bonder Automatic Die Bonder Die Bonding Machine

Product Details
Customization: Available
After-sales Service: Yes
Condition: New
Gold Member Since 2023

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  • Die Attach and Die Bonder Automatic Die Bonder Die Bonding Machine
  • Die Attach and Die Bonder Automatic Die Bonder Die Bonding Machine
  • Die Attach and Die Bonder Automatic Die Bonder Die Bonding Machine
  • Die Attach and Die Bonder Automatic Die Bonder Die Bonding Machine
  • Die Attach and Die Bonder Automatic Die Bonder Die Bonding Machine
  • Die Attach and Die Bonder Automatic Die Bonder Die Bonding Machine
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  • Overview
  • Product Description
  • Detailed Photos
  • Exhibition & Customers
  • Field Application
  • FAQ
Overview

Basic Info.

Model NO.
DB001
Speed
High Speed
Precision
High Precision
Warranty
12 Months
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Transport Package
Air Freight
Trademark
Himalaya
Origin
China
Production Capacity
200

Product Description

Product Description
 
Precision High Precision Condition New
Certification ISO Warranty 12 Months
Automatic Grade Automatic Installation Vertical
Driven Type Electric Transport Package Customized or Wooden Box Packaging
Trademark Himalaya Production Capacity 1
Automatic loading and unloading crystal fixing machine
Fully automatic loading and unloading, suitable for SMD, 1W and integrated high-power COB surface light source, triode and other flat support products
Modular design, new optimized layout, focus on quality, with the best stable performance
You can flexibly choose different configurations such as four crystal rings, double dispensing heads, double glue plates, 25cm long brackets, etc., to create the most suitable products for customers
Brand-new tying head design, fast die bond cycle up to 180ms


Patented head binding, accurate positioning and more stable operation;
5mil small chip processing capacity
Design a variety of chip search methods, suitable for the search of various shapes of wafers
Ultra-long PIN (65ms) processing capability to meet different customer needs

 
Detailed Photos

Die Attach and Die Bonder Automatic Die Bonder Die Bonding Machine

Clip Bonder High-speed Clip Bonding System

placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ;

Up to 20Clips / Cycle;

Prebond & Posbond function;

Solder patch & solder paste inspection function;

High precision linear drive die bond head;

High precision clip punching system;

The multi dispensing independent control system provides more accurate glue control, equipped with glue detection, with automatic glue filling function;

Multiple configurations meet various market demands, as well as customization according to special demands;

Freely match various types of reflow equipment.

Advantages of Die Attach
DA801/DA1201 can be configured;
Placement accuracy: ±10-25μm@3σ;
Theta placement accuracy: ±1°@3σ;
Stable force control system;
Dual dispensing system, support dipping / jetting / writing epoxy process.
 

Die Attach and Die Bonder Automatic Die Bonder Die Bonding MachineDie Attach and Die Bonder Automatic Die Bonder Die Bonding Machine
Exhibition & Customers

Die Attach and Die Bonder Automatic Die Bonder Die Bonding Machine

Field Application

 

Die Attach and Die Bonder Automatic Die Bonder Die Bonding Machine
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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