Mobile Digital Products/Copper Foil/FPC Steel Sheet/Pi/Cvl/Barcode/Qr Codel Green Laser Marking Machine

• Customization: Available
• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Cooling System: Air Cooling
• Laser Wavelength: UV Laser, CO2 Laser
• Laser Classification: Semiconductor Laser
• Product Name: PCBA & IC & Wafer Marking Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

 

The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of film or separation paper ;
Double vehicle processing, fast station switching

 

Characters:
The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of film or separation paper ;
Double vehicle processing, fast station switching and efficient processing.

Application:
It is applied to the marking of tracing information such as copper foil, FPC steel sheet, PI, CVL, barcode, QR code and characters of FPC soft board in the fields of mobile digital products, wearable devices, automotive electronics and so on.

Model	HDZ-FPC4530D
Laser type	Green laser, UV laser, fiber laser
Range of laser BOX	50mm*50mm
Adapt to substrate size	100mm*100mm-300mm*450mm
Adapt to substrate thickness	0.036mm-1.6mm
Process way	one side
Final machining position accuracy	±0.1mm(CCD location)
Supported file format	Dxf,Plt
Cooling mode	Air cooling / Water cooling
Supported system	Can be  connected to MES/IMS/PMS/ERP system
Overall dimension	1300mm*1600mm*2200mm

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.