Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine

• Customization: Available
• After-sales Service: Yes
• Condition: New
• Model NO.: HM001
• Speed: High Speed
• Precision: High Precision
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Transport Package: Air Freight
• Trademark: Himalaya
• Origin: China
• Production Capacity: 200

Product Description

Product Description

 

Precision	High Precision	Condition	New
Certification	ISO	Warranty	12 Months
Automatic Grade	Automatic	Installation	Vertical
Driven Type	Electric	Transport Package	Customized or Wooden Box Packaging
Trademark	Himalaya	Production Capacity	1

Automatic loading and unloading crystal fixing machine
Fully automatic loading and unloading, suitable for SMD, 1W and integrated high-power COB surface light source, triode and other flat support products
Modular design, new optimized layout, focus on quality, with the best stable performance
You can flexibly choose different configurations such as four crystal rings, double dispensing heads, double glue plates, 25cm long brackets, etc., to create the most suitable products for customers
Brand-new tying head design, fast die bond cycle up to 180ms

Patented head binding, accurate positioning and more stable operation;
5mil small chip processing capacity
Design a variety of chip search methods, suitable for the search of various shapes of wafers
Ultra-long PIN (65ms) processing capability to meet different customer needs
 

Detailed Photos

Clip Bonder High-speed Clip Bonding System

placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ;

Up to 20Clips / Cycle;

Prebond & Posbond function;

Solder patch & solder paste inspection function;

High precision linear drive die bond head;

High precision clip punching system;

The multi dispensing independent control system provides more accurate glue control, equipped with glue detection, with automatic glue filling function;

Multiple configurations meet various market demands, as well as customization according to special demands;

Freely match various types of reflow equipment.

Advantages of Die Attach
DA801/DA1201 can be configured;
Placement accuracy: ±10-25μm@3σ;
Theta placement accuracy: ±1°@3σ;
Stable force control system;
Dual dispensing system, support dipping / jetting / writing epoxy process.
 

Exhibition & Customers

Field Application

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.