Variousoptical Glass/ Filter Glass Cutting & Lobing Machine with Self-Developed Cutting Process Technology Patent

• After-sales Service: Provided
• Condition: New
• Warranty: Provided
• Automatic Grade: Manual
• Installation: Vertical
• Driven Type: Pneumatic
• Product Name: Glass Cutting & Lobing
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Product Features

• Ultra-fast pulsed picosecond laser with high peak power, stable and reliable

• Self-developed cutting process technology patent, excellent kerf quality, no surface damage

• High dimensional accuracy, small chipping, low thermal impact, excellent processing quality

• Automatic loading and unloading, inspection, sorting and lobe functions

Application

Cutting of full-screen glass,
sapphire, digital 3D front and
back cover glass, various
optical glass, and filter glass

echnical specification
Cutting Laser	Picosecond 1064nm Laser
Lobe Laser	CO2
Cutting Laser Power	70W
Lobe Laser Power	55W
Laser Life	>20000h
Platform Speed	1000mm/s
Control System Software	Integrated vision, laser and motion

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.