Factory Price Precision Laser Drilling Machine for Thin Film/Hard and Brittle Materials

• After-sales Service: Provided
• Condition: New
• Warranty: 12 Months
• Automatic Grade: Manual
• Installation: Vertical
• Driven Type: Pneumatic
• Product Name: Thin Film Laser Drilling
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Product Features

• Very high peak power laser which meets various precision processing  hard-brittle materials

• Patented optical shaping technology for thin film applications (Min pore size of 50μm PE film up to 1.8μm)

• Various drilling techniques which meet the needs of straight, tapered, and shaped holes

• Self-developed software, free to set the process menu according to the process requirements

Application

Various thin films fine processing
(precision drilling of PE films) and
hard-brittle material substrates
drilling/cutting (ferrite, sapphire,
various glasses, silicon wafers,
various ceramics and heat-sensitive
polymers, etc.)

Technical specification
Laser wavelength & type	355nm Nanosecond Laser / 355nm Picosecond Laser
Laser Power	15/30/50W
Min. hole diameter	1.8μm @ 0.5mm PE film
Drilling efficiency	20-100 holes/sec @ 50μm PE, 3-5 sec/hole @ 0.75m ferrite
Structure formation & automation	Gantry structure, provide manual and fully automatic loading and unloading options
Power requirements	220V/50Hz/16A
Overall Power Consumption	<2000W

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.