| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | Provided |
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Application areas:
1. Used in household appliances, office equipment, automotive circuits and other fields.
2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers.
Features:
1,The equipment can realize the automatic loading and unloading, positioning, coding, reading and proofreading, automatic receiving, flipping and double-sided marking of large-size PCBA boards and packaging substrates (inner board, outer board) and other products.
2,Optional servo platform: the servo platform transmits power through high-precision ball screws, and is guided by high-precision linear guides, which can complete linear movement.
3. Optional linear platform: a motion control system integrated with linear motors and linear encoders as the main components, featuring high precision, fast speed and high response.
4. Automatic focusing system: high-precision automatic focusing system can ensure the coding quality of products with different thicknesses.
5. Adsorption fixture: Negative pressure adsorption and product board edge pressing structure, effectively ensuring the stability of coding.
6. Optional loading and unloading machine: The equipment is equipped with a customized loading and unloading trolley, which can realize stacking product loading and unloading, can be customized L-frame inclined vertical loading and unloading, and compatible with AGV trolley automatic loading and unloading, effectively improving production efficiency.
7. Optional plate turning machine: The equipment can be equipped with a customized plate turning machine to realize double-sided processing of the product, and can be equipped with a six-axis industrial robot to realize double-sided processing of single coding host or double-sided processing of double coding host in series.
Equipment parameters
| machine type | HDZ-PCB6565AL |
| Adapt to PCB board size | Min:100×100mm |
| MAX:650×750mm | |
| Adapt to PCB board thickness | 0.5mm-3mm |
| Adapt to package substrate size | MAX:650*750mm |
| Adapt to package substrate thickness | 0.2mm-4.2mm |
| Laser light source | Can be equipped with: CO2, green light, ultraviolet, optical fiber |
| Final machining position accuracy | ±0.1mm (CCD positioning) |
| power supply | 380V,50Hz |
| Gas source | 0.6-0.8MPa |
| Equipment size | 3090mm*2000mm*1950mm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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