UV Engrave Machine for Marker Metal Glass Cup Plastic Rubber Leather UV Laser Marking Machine Water Bottle Printing Machine

• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Laser Wavelength: Fiber Laser
• Laser Classification: Semiconductor Laser
• Model NO.: EP-15/25/30-THG-D
• Product Name: UV Laser Marking
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

1. Marking of electronic products' LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.

Features:

1. Dual-station rotary worktable; one is used for loading and unloading and the other is used for marking, which can efficiently improve the working efficiency
2. With safety light curtain, it can achieve safe and high-efficient production.
3. This worktable can be used with UV, green light, infrared and other lasers together. It has several models such as EP-15-THG-D and EP-15-SHG-D.

Specifications:

Machine model	EP-15/25/30-THG-D
Laser wavelength	355nm
Laser power	4W / 7W / 10W /15W / 25W
Min. marking line width	10µm-15µm
Marking speed	250 characters/sec
Marking scope	100*100mm
Standard lens	F160
Pulse repetition frequency	10-200kHz
Cooling mode	Water cooling
Power supply	AC 220V, 50Hz, 16A
Total power consumption	≤1.5kW
Overall dimension	800mm*1025mm*1500mm

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.