30W Industrial CO2 Laser Marking Equipment Laser Marker Machine for Plastic/Paper/Wood/Plywood/Acrylic

• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Cooling System: Air Cooling
• Laser Wavelength: CO2 Laser
• Model NO.: CO2-H120/H200
• Laser Classification: Semiconductor Laser
• Product Name: CO2 Laser Marking
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, button, textile cutting, gifts and crafts, rubber product.

 

Features
Low power imported laser, rear focusing, integrated equipment, adjustable optical girder, extensive processing of plane, air cooling, widely applied to graphics and texts marking of gifts and crafts, food packaging, electronic component, PCB bar code, FPCB, ceramic substrate, semiconductor, crystal glass, plastic connector, rubber button, SMD component and other materials.
Specification:

Machine model		CO2-H55i	CO2-D30	CO2-G10
Laser characteristics	CO2 laser
	Largest power	55W	30W	10W
	Power stability	±5%	±5%	±10%
Marking area		85mm*85mm		50mmx50mm
Engraving speed		≤3m/s
Min. line width		0.12mm		0.05mm
Min. character		0.6mm		0.2mm
Repeated position		±0.01mm
Protection level		IP54
Cooling mode		Air cooling
Power supply voltage		220V/10A	220V/10A	220V/10A
Power consumption		2kW	900W	300W
Best working environment	Temperature	15ºC-30ºC
	Humidity	45%-75%
Dimension (L*W*H)	Optical system	1120x620x1370mm
	Control system	Integrated machine
	Cooling system	Air cooling
Weight	Optical system	110kg
	Control system	Integrated machine
	Cooling system	Air cooling

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.