Green Laser/UV Laser Wafer Marking Machine for 6-Inch/8-Inch /12-Inch

• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Cooling System: Air Cooling
• Laser Wavelength: UV Laser, CO2 Laser
• Laser Classification: Semiconductor Laser
• Product Name: PCBA & IC & Wafer Marking Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

Applicable for the 6-inch, 8-inch and 12-inch wafer marking

 

Features:

1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking.
2. Fully-automatic loading and unloading, automatic edge searching, simple operation and high efficiency.
3. The whole system adopts computer control, Windows operation platform,interface in English, self-developed software, easy to operate.
4. With high automation, it has the function of automatic fault alarm.
5. Precise marking to the product DIE.

Specification:

Machine model	HDZ-WAF500	HDZ-WAF600
Laser type	Fiber laser, CO2  (optional)	UV, green light (optional)
Laser power (customized according to the customer's actual marking need)	Fiber 20W,CO2 10W	UV 7W, green light 10W
Cooling mode	Air cooling	Water cooling
Final processing repeated positioning precision	±0.2mm	±0.05mm
Processing product type	2 inch, 4 inch, 6 inch wafer	6 inch, 8 inch, 12 inch wafer
Power supply	220V, 50Hz	220V, 50Hz
Overall dimension (for reference)	900mm*1150mm*1700mm	1950mm*1650mm*1635mm

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.