Fully Automatic Laser Overflow Removal Machine for Package Moulding and Pindeflashing

• After-sales Service: Provided
• Condition: New
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Automatic Laser Deflashing
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Product Features

• Laser scanning and vaporization for deflashing. No chemical softening or high-pressure water jetting required

• Optical shaping technology, ensuring no damage to tube pins.Improving removal efficiency

• Dual quad laser head, front and back side laser deflashing synchronously, Increase production capacity.

• Automatic loading and unloading,With intelligent identification, automatic flip and anti-reverse function

 

Application

All kinds of package moulding and pin
deflashing
SOT89/SOT223 a class of high-pressure
water is hard to remove the overflow
Laser deflashing residue on the surface
of heat sink of various power devices

Technical specification
Operating mode	Two-way four-head, synchronous work
Laser power	50W/100W×2/4
Undistortion scan area	300×150mm^2
Laser vaporization depth	0.004-0.2mm adjustable
UPH	≥7500pcs/hr@SOT89
Max. loading volume at one time	300 strips
Repeat accuracy	±0.05mm

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.