Factory Fully Automatic UV Laser Marking Machine for Computer PCBA Chip Circuit Board

• Customization: Available
• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Laser Wavelength: UV Laser, CO2 Laser
• Laser Classification: Semiconductor Laser
• Product Name: PCBA & IC & Wafer Marking Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

Applicable for the packaged IC marking of DIP, QFN and BGA.
 

 

Features:
1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser output, direction inspection function of intelligent vision system, sampling inspection function of marking effect
2. Friendly HMI
3. Imported double-head 20W fiber laser marking system; the green laser, UV laser, CO2 laser and other laser sources are optional
4. With special fume removal device, it can quickly extract the fume and dust produced during marking to protect the marking area environment
5. It complies with CE MARK and SEMI standard

Specification:

Machine model	HDZ-SIC100	HDZ-SIC200
Marking scope	320mm*160mm	320mm*160mm
Product specification	L: 160-320mm; W: 30-80mm	L: 160-320mm; W: 30-80mm
Font	TFT and SHX; with font library module modification program
Final processing repeated positioning precision	±0.1mm	±0.1mm
UPH	1200 pieces/h (idle)	1200 pieces/h (idle)
Power supply	AC 220V, 50/60Hz	AC 220V, 50/60Hz
Air source	0.6-0.8 MPa	0.6-0.8 MPa
Overall dimension	2525mm*1665mm*2000mm	2515mm*1420mm*2000mm

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.