12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above

Product Details
Customization: Available
After-sales Service: Provided
Warranty: 12 Months
Gold Member Since 2023

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  • 12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above
  • 12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above
  • 12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above
  • 12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above
  • 12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above
  • 12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Driven Type
Pneumatic
Product Name
12 Inch CMP Device - Horizon300
Advantage 1
Vertical Wafer Clean Configuration
Advantage 2
4-Head & 3-Platen Polisher
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above
  • 4-Head & 3-Platen polisher; Vertical wafer clean configuration.
  •  Integration of multiple advanced endpoint system and a fully precise process control system.
  • Meet CMP process requirements for 28nm node and above.
  • Mature architecture, evident cost advantage in production line.
 
Application

12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above

Exhibition & Customers

12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and AboveJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

12 Inch CMP Device Machine Meet CMP Process Requirements for 28nm Node and Above
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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