• Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser
  • Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser
  • Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser
  • Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser
  • Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser
  • Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser

Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser

After-sales Service: Provided
Condition: New
Warranty: 12 Months
Automatic Grade: Automatic
Installation: Vertical
Driven Type: Electric
Customization:
Gold Member Since 2023

Suppliers with verified business licenses

Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Product Name
Low-K Wafer Laser Grooving Equipment
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
OEM/ODM Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser
Product Features
  • 8/12 inch compatible

  • Ultra-fast UV picro-second laser. Excellent process results

  • Automatic adjustment of grooving width

  • Auto-focus, image memorization and  identification, manual/auto mode switching function

  • Multi-CCD positioning & reinspection function

 

Application
LOW-K wafer
Laser Grooving and scribing
Technical specification  
Wafer Size 8 inch, 12 inch
Wafer thickness 70-700μm
Scribe channel width ≥40μm
Grooving width 30-80μm adjustable
Processing speed 300-1000mm/s
Positioning accuracy ±2μm
Grooving depth 10-20μm
Cutting Depth accuracy ±3μm
Grooving accuracy of the whole piece ±8μm

 

 
 
Exhibition & Customers


Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second LaserLow-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second LaserJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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