| After-sales Service: | Provided |
|---|---|
| Warranty: | Provided |
| Laser Classification: | Semiconductor Laser |
| Product Name: | Laser Power Drum Cutting Machine |
| Feature 1: | Guaranteed Quality |
| Feature 2: | Customized According to Needs |
| Customization: |
|---|
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MPS-1500SL series laser processing flexible production line is the latest "fully automatic sheet metal laser cutting and forming equipment" developed by the great family. It provides an efficient automatic solution for traditional sheet metal processing,
Product features:
1. Meet the diverse needs of coil material processing. Expandable to an automated production line, combining laser cutting and automation perfectly to create a composite laser processing mode;
2. Adopting a new generation feeding system, which increases production per unit time while saving time and costs;
3. Equipped with a dynamic real-time feedback processing system, the processing status of the equipment is displayed in real-time in front of the user;
4. The cutting table is synchronized with the uncoiling servo feeding system, running at the same speed to achieve the cutting of rolled sheets;
5. Independent operation console, convenient for users to place left and right;
6. The direction of the safety door can be changed from left to right for easy operation;
7. The electrical cabinet and bed are integrated, making maintenance and debugging convenient;
8. It has the function of reverse loading and cutting standard plates.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
Suppliers with verified business licenses
Audited Supplier 
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