• Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device
  • Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device
  • Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device
  • Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device
  • Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device
  • Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device

Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device

After-sales Service: Provide
Warranty: 12 Months
Product Name: Flip Chip Bonding Machine
Application: Large-Scale Integrated Circuit Device
Certification: ISO
Condition: New
Customization:
Gold Member Since 2023

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Jiangsu, China
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
JDH-400
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
  
Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device
The flip chip bonding machine is mainly used
in the flip welding process of large-scale integrated
circuit device manufacturing to complete the flip
interconnection between chip and substrate, so that
the package has better circuit characteristics of high
frequency, low delay and low crosstalk, and can
effectively improve the reliability of assembly and
interconnection of circuit, component or system.
 
 
 
Application

Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device

Exhibition & Customers

Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit DeviceJdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit DeviceJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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