Interactive Optical Fiber Laser Cutting Machine with a Motion Control System

• After-sales Service: Provided
• Warranty: Provided
• Laser Classification: Semiconductor Laser
• Product Name: Laser Cutting Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• Model NO.: MPS-8025H
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

MPS-8025H series is a dual drive gantry interactive optical fiber laser cutting equipment tailored for the sheet metal processing industry. It can cut all kinds of metal materials, with the advantages of stable performance, high cutting efficiency, conven

 

 

Product features:
1. This product adopts a gantry dual drive structure, with the bed as an integral welded component and the crossbeam as an aviation cast aluminum component. Both are rough machined after annealing, and then subjected to secondary vibration aging treatment before overall precision machining, achieving extremely high form and positional tolerance accuracy.
2. The equipment is stable and adopts a motion control system. After 20 years of mature use and continuous improvement in the field of laser cutting, the system's high performance, high reliability, and user-friendly operation interface ensure humanization and convenience of operation, and ensure the orderly progress of cutting processing.
3. The entire machine adopts a servo motor dual drive precision reducer and a gear rack structure, ensuring the high-speed and efficient operation of the equipment, as well as better accuracy and stability.
4. Advanced gas path control system design, equipped with imported pneumatic components, allows customers to freely use high and low pressure cutting auxiliary gases according to their needs, ensuring cutting quality while effectively reducing usage costs.
Application industries: various mechanical manufacturing and processing industries such as rail transit, shipbuilding, automobiles, engineering machinery, agricultural and forestry machinery, electrical manufacturing, elevator manufacturing, household appliances, grain machinery, textile machinery, tool processing, petroleum machinery, food machinery, kitchen utensils and bathroom, decorative advertising, laser external processing services, etc.
Applicable materials: various metal materials such as carbon steel, stainless steel, aluminum alloy, brass, copper, pickled plate, galvanized plate, silicon steel plate, electrolytic plate, titanium alloy, manganese alloy, etc.

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.