High Precision High-Efficient UV Laser Marking Cutting Machine for Wafers Cutting Processing

• After-sales Service: Provided
• Warranty: Provided
• Laser Classification: Semiconductor Laser
• Condition: New
• Product Name: Automatic Laser Cutting
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

 

 

Brief Description

Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing

Features:

1. With 355nm UV laser, the cutting machine has stable performance, good light spot, and long-time stable operation
2. The reliable and high-precision X-Y-Z-θ worktable and excellent accelerating and decelerating performance can efficiently improve the unit time productivity of system 
3. Through vacuum absorption, the wafer cannot move during platform moving
4. The wafer can be positioned through positioning the Mark point on the wafer, which can ensure the cutting precision
5. The high-efficient and flexible software operation system has a simple and concise interface
6. Automatic loading and unloading, robot carrying and automatic edge searching function

Specification:

Machine model	HDZ-WUVC100	HDZ-WUVC200
Laser power	15W	15W
Laser wavelength	355nm	355nm
XY axis repeated positioning precision	±1µm	±1µm
θ axis repeated positioning precision	±15s	±15s
Cutting line width	>15µm	>15µm
Cutting depth	>25µm	>25µm
Cutting speed (*The cutting speed varies from different products)	100mm/s	100mm/s
Loading and unloading mode	Manual	Robot carrying; automatic edge searching
Processing product type	2 inch-12 inch wafers	2 inch-12 inch wafers
Power supply	AC 220V,50Hz	AC 220V,50Hz

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.