| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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1,Scope of application
Small integrated wastewater treatment equipment, small integrated waste gas treatment device, precious metal recovery device, "zero discharge" system for wastewater reuse, special hanger mechanism (rotating electroplating mechanism, vibrating screen, roller, etc.), automatic analysis and adding system of plating bath, and integrated annular filter in the inlet slot.
2,application area
It is mainly used in the high precision and small scale wet chemical treatment technology of military, electronic and new materials, such as electroplating, plating, oxidation, etching and cleaning.
3,Equipment features
1, modular design: each process unit adopts relatively independent standardization to facilitate maintenance.
2. Highly integrated: highly integrated design concept, compact equipment and small footprint.
3. Gao Zhineng: automatic control can be realized, personnel intervention can be reduced, and process consistency and stability can be ensured.
4, high technology fit: customized design according to the actual process of users, to ensure that all the concepts involved in the equipment are based on the technology.
5, green environmental protection: adopt the advanced design concept of energy saving and emission reduction at home and abroad, to achieve the maximum extent of "green" electroplating;
6, high technology: integrates high technology, technology, materials and supporting devices at home and abroad.
4,Application field
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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