• B100 Tool Is Mainly Used for Advanced Packaging Industry
  • B100 Tool Is Mainly Used for Advanced Packaging Industry
  • B100 Tool Is Mainly Used for Advanced Packaging Industry
  • B100 Tool Is Mainly Used for Advanced Packaging Industry
  • B100 Tool Is Mainly Used for Advanced Packaging Industry
  • B100 Tool Is Mainly Used for Advanced Packaging Industry

B100 Tool Is Mainly Used for Advanced Packaging Industry

After-sales Service: Provide
Condition: New
Certification: ISO
Warranty: 12 Months
Automatic Grade: Automatic
Installation: Vertical
Customization:
Gold Member Since 2023

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Jiangsu, China
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The supplier has 1 QA and QC inspection staff
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Driven Type
Electric
Product Name
Glue Filling Machine
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description

 

B100 Tool Is Mainly Used for Advanced Packaging Industry

Tool Spec
Machine  Type In-line Sputter PVD I100
Process  Chamber 3,6  target  (optional)
Plasma  Source RF for l100
UItimate  Vacuum 10-8 Pa
Power 8kW,max15kW
Carrier Gas Ar,N2
Bias DC Bias (optional)
Accompanying   Magnet (optional)
Substrate  Size up  to  490*640  mm
Temperature max   400ºC
Thickness  non-uniformity <3.0%(12inch   wafer)
Films Ti,Cu,Ag,Ta,Au,etc.
 
Exhibition & Customers

B100 Tool Is Mainly Used for Advanced Packaging IndustryB100 Tool Is Mainly Used for Advanced Packaging IndustryJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

B100 Tool Is Mainly Used for Advanced Packaging Industry
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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