3 Axis Dispensing Machine with Windows System for Solder Past/Fingerprint Identifcation Module

• Customization: Available
• After-sales Service: Provided
• Precision: High Precision
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Product Name: Dispensing Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Standard Features 

Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
ESD grounding point-
CE certifed

 

Optional Features 

Automatic constant temperature system to ensure the fuidity consistent
Laser Height Detection to calibrate Z axis automatically for component
deformation

Product advantage:

TSV Series desktop dispensing system is applicable for LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, fingerprint identifcation module, etc. 

 

Specifications	TSV-300	HSV-300
Dimension (mm)	L810×W660×H760	L900×W650×H1460
Weight (kg)	105	190
Control	Industrial personal computer + motion control card
Software	Anda control software + windows system
Programming	Visual programming
Number of spindles	X,Y,Z
Spindle drive	Servo motor + module
Working area (mm)	X:260 ; Y:260 ; Z:100
Quantity of rubber valve	1 (standard configuration)
Max. Moving speed (mm/s)	800
Repeatability (mm)	± 0.025
Coating capacity (cc)	30
Valve nozzle cleaning device	Vacuum cleaning
Equipment alarm	Menu + sound and light alarm
Coating inspection	Automatic detection
Power supply	220V 50/60Hz
Required air pressure (Mpa)	≥ 0.65
Safety standards	CE
Rated power (kw)	1
Standard configuration	CCD visual positioning;  Electrostatic interface;  232 scanner socket

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.