| After-sales Service: | Provided |
|---|---|
| Warranty: | Provided |
| Laser Classification: | Semiconductor Laser |
| Product Name: | Laser Cutting Machine |
| Feature 1: | Guaranteed Quality |
| Feature 2: | Customized According to Needs |
| Customization: |
|---|
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Product Introduction:
The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D series laser cutting machine adopts imported servo drives, customized systems, and other configurations, greatly meeting the needs of customers.
Product features:
1. This product adopts a gantry structure, high-quality steel welded bed, honeycomb shaped high-strength crossbeam, combined with excellent heat treatment and machining processes, to ensure the rigidity of the machine tool while ensuring long-term stability.
2. Adopting the Han's control system, after years of mature use and continuous optimization and improvement in the field of laser cutting, the high performance, reliability, and user-friendly operation of the Han's control system have been achieved.
3. The servo motor dual drive precision reducer and gear rack structure ensure the high-quality dynamic performance of the equipment.
4. Advanced gas path control system design, equipped with imported pneumatic components, allows customers to freely use high and low pressure cutting auxiliary gases according to their needs, ensuring cutting quality while effectively reducing usage costs.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
Suppliers with verified business licenses
Audited Supplier 
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