New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes

Product Details
Customization: Available
After-sales Service: Provided
Warranty: 12 Months
Diamond Member Since 2023

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  • New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes
  • New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes
  • New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes
  • New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes
  • New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes
  • New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Driven Type
Pneumatic
Product Name
Laser Drilling Machine
Advantage 1
Maintenance-Free Laser
Advantage 2
Effective Energy Saving
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
HD650L2 SERIES  Product advantages
The new laser and high speed scanning galvanometer are specially customized for the processing of smaller and micro blind holes and through holes.

Maintenance-free laser without inflating, effective energy saving, low comprehensive operating costs
High precision movement platform, high precision positioning recognition, can realize high precision machining zone
Professional service response, quick technical support
New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes
New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes
 
Application

New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes

Exhibition & Customers

New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through HolesNew Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through HolesJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

New Laser and High Speed Scanning Galvanometer Machine for Smaller Micro Blind Holes Through Holes
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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