| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
1,Index parameter
Rated temperature: 700-1050 degrees centigrade
Maximum temperature: 1200 degrees centigrade
Sintering atmosphere: air
Heating element: heating wire / silicon carbide rod
Heating element layout: up and down heating
Effective height: 150mm/200mm/250mm/300mm
The total height of the equipment: < 2100mm
2,Progressiveness
1, accurate exhaust structure and control to effectively ensure furnace pressure.
2. Special heating zone setting, multi segment temperature control accuracy is higher, achieve precise temperature control of + 1 degrees centigrade.
3. Special furnace design, area production increased by 1.5-2 times.
4. Alumina hollow ball bricks are used in the furnace to resist strong alkaline corrosion.
5, the driving structure and the roof exhaust structure ensure the realization of the above performance.
6, energy conservation, electricity, atmosphere and other energy saving programs.
(Ps expert's message: about 20% of the heat energy is dissipated by the end of the roller. To this end, the atmosphere roller hearth furnace on both sides of the heating rod sealing cavity and transmission seal cavity, all installed with air inlet nozzle, direct air blowing cooling roll rod ends, and the air of the seal cavity pressure from the installation hole pressure into the furnace, on the one hand the atmosphere is preheated, on the other hand, due to positive pressure, effectively prevent the rod hole heat dissipation! At the bottom of the heating section and the constant temperature section, a number of small holes are opened in the bottom of the insulation layer. The atmosphere is divided into the middle and right of the furnace at the bottom of the furnace, and the air volume is adjustable in the direction of the width of the 3 way. )
3,Detail display
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
){kind=link}