Glass Substrate Laser Induced Drilling Machine Customized Picosecond/Femtosecond Laser

• After-sales Service: Provided
• Condition: New
• Warranty: 12 Months
• Automatic Grade: Manual
• Installation: Vertical
• Driven Type: Pneumatic
• Product Name: Glass Substrate Laser Induced Drilling
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Product Features

• Customized picosecond/femtosecond laser. Laser flight pulse pointing, compatible with

• single point/spin cut drilling process. Integrated superior software algorithms that automatic optimization laser pointing and

• cutting paths and directions

• Automatic detection of undrilled holes
  
   

Application

Laser induced drilling through holes
and blind holes for special-shaped glass,
glass, RF components, optoelectronic
components, photomask plates, MEMS
components, glass based high-density
substrates, advanced wafer packaging,
glass spacer chips, Mini/Micro LED display
panel glass substrates, foldable screens, etc

Technical specification
Laser	Ultra-fast picosecond / femtosecond laser
Processing Product Size	X/Y: 350×350mm 12" glass wafer
Glass thickness	100-1500μm
Focused spot diameter	<3μm
UPH	≥5000 holes/sec
Platform positioning accuracy	≤±2μm
Repeat Positioning Accuracy	≤±1μm
Vision configuration	10 million pixels

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.