• Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment
  • Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment
  • Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment
  • Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment
  • Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment
  • Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment

Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment

After-sales Service: Provided
Condition: New
Speed: High Speed
Precision: High Precision
Certification: ISO
Warranty: 12 Months
Customization:
Gold Member Since 2023

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Jiangsu, China
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
SHD8120
Automatic Grade
Automatic
Product Name
Semiconductor Equipment
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment

Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment

Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment

Equipment Specifications
  DIE BONDER   SHD8120
  Loading method   Wafer stacking and tray
  Bonding method   Epoxy
  Bonding precision   X/Y≤±25um,θ<±3°
  Bonding speed (UPH)   Max 17K(variable depending on chip size and density of frame bonding)
  Wafer size   12 inches (compatible with 8 inches)
  Wire head rotation    0°-360°
  Wafer rotation   0°-360°
  Bonding pressure   30-500g
  MAP diagram   Available
  DAF   Optional
  Dispensing method   Double dispensing
  Painting   Available
  Chip size   0.3mmx0.3mm~4mmx4mm,Thickness         >75um
  Substrate size   Length:100-300mm,width:20mm-100mm,thickness:0.1-1mm
  Image recognition   256-level grayscale
  Resolution   640×480 pixels
  Recognition accuracy   0.25mil
  Dimensions (mm)   1800*1490*1500
 Equipment weight (kg)   1800
Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment
Exhibition & Customers

Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding EquipmentFully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding EquipmentJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

 

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