• Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment
  • Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment
  • Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment
  • Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment
  • Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment
  • Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment

Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment

After-sales Service: Provided
Condition: New
Speed: High Speed
Precision: High Precision
Certification: ISO
Warranty: 12 Months
Customization:
Gold Member Since 2023

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Jiangsu, China
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
SHM8120(120T)
Automatic Grade
Automatic
Product Name
Semiconductor Equipment
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

 
Product Description
Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment

Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment

Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment

Equipment Specifications
AUTOMOLD   SHM8120(120T)
Packaging quantity   2L/F/time/press
Press quantity   1-4 presses
Applicable L/F size   Width:20-80mm Length:124-270mm Thickness:0.1-0.6mm
Applicable resin size   Diameter 11-20mm(±0.2mm)Aspect ratio:1.2-1.7(Max 35mm)
Molding pressure   98~1176 kN(Max 120 tons)
njection pressure   4.9~29.4N(Max 3 tons)
Mechanical Time   25 seconds (minimum)
Machine specifications   Width 1685mm;Height 1840mm;Length 3725mm (4 presses)
Machine weight   10,000kg(4 presses)
Power supply   Three-phase 380VAC±10%;Power ≤51KW(4 presses)
Compressed air supply   Pressure ≥0.5Mpa,Flow rate ≥350L/Min,equipped with air filter
Exhaust requirements   ≥3000L/Min
Ambient temperature   0~40ºC(No icing)
Environmental humidity   Below 75%RH (No condensation)
Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment
Exhibition & Customers

Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging EquipmentFully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging EquipmentJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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