Series Electroplating Production Line/Precision Electroplating Equipment

• Customization: Available
• After-sales Service: Provide
• Warranty: 12 Months
• Model NO.: Electroplating Equipment
• Product Name: Electroplating Equipment
• Function: Precision Electroplating
• Certification: ISO
• Condition: New
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

  

Applications:

Automotive, electronics, machinery, hardware, home appliances, light industry, etc.

Applicable scope:

Applicable to zinc, nickel, gold, silver, copper, chromium, tin and other kinds of plating, iron and steel materials, aluminum,

magnesium. Titanium and its alloy oxidation, phosphating , electrophoresis treatment, chemical copper plating, nickel, etc.
 

Automatic production line features:

The series electroplating production line adopts the man-machine interface, the industrial control computer and the independent software to carry on the centralized control. The operation interface can display the working status and parameters of the production line in real time, and can record, save and modify the process parameters.

 

Precision Electroplating Equipment
 

The manufacture of various bumps, copper

pillars, graphics, RDL, TSV in the advanced IC

packaging process;Precision electroforming of MEMS

device microstructure.

Workpiece specification: wafer(8 inch and

below), square piece, etc;Uniformity of coating

thickness ≤ ±5%;The defect-free filling can be well

completed in the micropore with diameter less than

20um and depth width ratio greater than 5:1.

Electroless Ni/Pd/Au line

Chemically deposited nickel-palladium-gold metal

layers in Al/Cu material base;Can be used for PCB,

ceramic substrate andotherpackagingsubstratesurfa

cetreatment;ElectrolessNi/Pd/Austraightgoodflatnes

s,weldablity,corrosion resitance,wire bingding ablity;

Can be used to manufacture UBM in flipchip packaging

technology;Provides highly reliable electrical and

mechanical connections to both the circuit and solder

bumps of the chip.

 

Intelligent management system for electroplating and

cleaning workshop
 

Information visibility and collaboration of orders,

plans, supplies and inventory is key to successfully

coordinating all aspects of enterprise production. The

plating workshop MES is designed to help drive efficiency

through your network, optimizing supply chain operations.

 

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.