Ceramic Inserts/ Substrates/Devices/Phone Shells Continuous Push Plate Furnace

• After-sales Service: Provide
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Fhk Continuous Push Plate Furnace
• Application: PTC/Ntc/Mlcc
• Advantage: Factory Price
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

As a continuous production equipment, the push plate furnace is suitable for the discharge and sintering of various molding processes such as injection, casting, dry pressing, isostatic pressing, etc. It is mainly used in the integrated sintering process of electronic components such as PTC, NTC, MLCC, ceramic inserts, ceramic substrates, ceramic devices, ceramic phone shells, inductor powders, and NFC ferrite magnetic thin sheets.


characteristic

Working temperatures RT-1400 ºC and RT-1600 ºC

Reasonable power distribution and unique air intake and exhaust system

Unique large dome structure, good stability, uniform furnace temperature, and good product consistency

Stable transmission mode, smooth propulsion, no crawling or shaking

Fully automatic rotary operation, using PLC control for reliable operation

The temperature control method is automatic voltage adjustment by thyristor, with functions such as soft start, soft turn off, constant current/constant voltage, etc

Imported control instruments for precise control

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.