| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Warranty: | 12 Months |
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| System Parameters | |||
| Hi-Precision Laser Resistor Trimming Automation System Solution Parameters | |||
| Configurations | HTS900-RA | HTS901-RA | |
| Laser | Laser type | Fiber laser | UV lase |
| Central wavelength | 1064nm | 355nm | |
| Qutput power | 20W | 1W/4W(optional) | |
| Repeat frequency | 1-100kHz | 1-500kHz | |
| Pulse width | 3-500ns | <15ns | |
| Typical spot size | 15-40um | 10-15μm | |
| Laser Beam Positioning |
Scan range | 70mm*70mm | 50mm*50mm |
| Scan resolution | 1μm | lμm | |
| Repeated positioning accuracy | ±1μm | ±1μm | |
| Vision | Coaxial monitoring system | 500W pixel camera | |
| Side axis positioning system | 500W pixel camera,with CCD intelligent controller (optional) | ||
| Work platform |
Moving platform | Linear motor with grating rule | |
| Moving range | 400mm*50mm | ||
| Repeated positioning accuracy | ±2μm | ||
| Max mowing speed | 1000mm/s | ||
| Processing size/size of processed substrate |
70mm*70mm/01005&above | ||
| Measure- ment System |
Compatibility of test system | Compatible with low/medium/high resistance measurement | |
| Test method | 2-wire or 4-wire measurement | ||
| Resistance measurement | Measurement range 50mQ~100MO | ||
| ow resistance:±(0.05%+0.5%/R(Q),Medium resistance:±0.05%,High resistance:±(0.05%+0.05%xR(MQ) | |||
| Voltage measurement | Measurement range -10V~+150V,full range measurement accuracy is 0.01% | ||
| Measurement channel | 24~288(each board has 24 channels,expandable) | ||
| Measurement time | 2us/time,can be adjusted according to customer needs | ||
| Error compensation | One-key automatic callibration | ||
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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