• High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
  • High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
  • High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
  • High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
  • High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
  • High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)

High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)

After-sales Service: Provide
Warranty: 12 Months
Laser Type: Fiber Laser/UV Laser
Certification: ISO
Condition: New
Function: Laser Resistor Trimming
Customization:
Gold Member Since 2023

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Jiangsu, China
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
HTS900
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
 
High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
Laser resistor trimming is the mainstream process of resistor trimming , which has the highest precision and efficiency , and can complete the functiontrimming of the circuit . The high-precision laser resistor trimming automation system is equipped with a fully automatic loading and unloadingmechanism and a visual positioning automatic correction system based on the precision laser resistance trimming system . It is easy for automated massproduction , and is suitable for rapid mass production of various specifications of chip resistors .

System Parameters
Hi-Precision Laser Resistor Trimming Automation System Solution Parameters
  Configurations HTS900-RA HTS901-RA
Laser Laser type Fiber laser UV lase
Central wavelength 1064nm 355nm
Qutput power 20W 1W/4W(optional)
Repeat frequency 1-100kHz 1-500kHz
Pulse width 3-500ns <15ns
Typical spot size 15-40um 10-15μm
Laser Beam
Positioning
Scan range 70mm*70mm 50mm*50mm
Scan resolution 1μm lμm
Repeated positioning accuracy ±1μm ±1μm
Vision Coaxial monitoring system 500W pixel camera
Side axis positioning system 500W pixel camera,with CCD intelligent controller (optional)
Work
platform
Moving platform Linear motor with grating rule
Moving range 400mm*50mm
Repeated positioning accuracy ±2μm
Max mowing speed 1000mm/s
Processing  size/size  of
processed  substrate
70mm*70mm/01005&above
Measure-
ment
System
Compatibility of test system Compatible with low/medium/high resistance measurement
Test method 2-wire or 4-wire measurement
Resistance measurement Measurement range 50mQ~100MO
ow resistance:±(0.05%+0.5%/R(Q),Medium resistance:±0.05%,High resistance:±(0.05%+0.05%xR(MQ)
Voltage measurement Measurement range -10V~+150V,full range measurement accuracy is 0.01%
Measurement channel 24~288(each board has 24 channels,expandable)
Measurement time 2us/time,can be adjusted according to customer needs
Error compensation One-key automatic callibration
High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
Application

High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)

Exhibition & Customers

High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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