Fully Automatic Semiconductor Molding Equipment with Standardized Mold Structure for Easy Replacement

• Condition: New
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Auto Molding Equipment
• Feature 1: Fully Automatic
• Feature 2: CCD Image Detection
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Characteristic

Fully automatic plastic packaging system, also known as fully automatic packaging system;

Servo control system, PLC (Omron)+controller;
WIN10+15 inch touch screen+touch keyboard;
CCD image detection, anti backtracking detection for incoming materials;
Can correspond to a large lead frame of 90mmx300mm;
Standardized mold structure for easy replacement;
Equipped with a visual System identification to identify the feeding direction;
Efficient cake feeding components, aluminum material box feeding;
Automatic box entry, double material receiving box stacked material receiving;
Supports flexible expansion of up to 4 sets of compressors, achieving high UPH;
Optional mold vacuum pumping function, isolation mold function, and post molding detection function;
Using imported raw materials, with stable performance, high accuracy, long service life, and guaranteed quality;
 

Performance Parameters

Closing pressure: 98-1764kN;

Injection pressure: 4.9-29.4kN adjustable;
Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm;
Applicable size of plastic sealing material: diameter φ   11-20mm, length/diameter 1.2-2.0 (Max 35mm).

 

Equipment Details
Sample DisplaySample Display

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.